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Advantech expands modular HMI range with GPU-supported models for edge AI applications

30 Sep 2026

Advantech, provider of intelligent systems and edge computing, has expanded its modular HMI lineup with the introduction of TPC-B620, a new GPU-supported model designed to deploy Edge AI applications directly on the factory floor.

Image source: Advantech // the Advantech B620 computing box module is designed to deploy Edge AI applications directly on the factory floor.
Image source: Advantech // the Advantech B620 computing box module is designed to deploy Edge AI applications directly on the factory floor.

As smart manufacturing grows, shifting processing workloads from remote clouds to the machine level has become a strategic necessity. By enabling localised computing at the edge, this new model ensures maximum data sovereignty by keeping proprietary production know-how on-site. TPC-B620 delivers ultra-low latency for instant decision-making and significantly reduces bandwidth costs by eliminating the need to transmit massive amounts of raw data.

Scalable hardware architecture

To realise the full benefits of edge-level intelligence, the TPC-B620 modular AI HMI computing box is engineered with a robust hardware infrastructure purpose-built for harsh factory environments. The system features versatile GPU expansion capabilities, supporting dedicated graphics cards, including the NVIDIA RTX series - with up to 70W power delivery. This optional GPU support gives manufacturers flexibility to scale computing performance for demanding Edge AI applications. Furthermore, the TPC-B620 offers superior multi-port connectivity with up to 11 LAN ports (3 built-in as standard, with support for up to 8 additional ports via half-size add-on cards). This high-density connectivity enables the simultaneous integration of multiple industrial cameras, providing the high-bandwidth interface required to run localised AI vision workloads on-site without performance bottlenecks.

Reliability and modular flexibility

Designed to address demanding edge computing workloads, the TPC-B620 combines high-performance thermal engineering with an extensive modular display ecosystem to deliver exceptional field reliability. By utilising proprietary aluminum alloy spot welding and advanced heat pipe technology, this modular AI HMI ensures the CPU operates at its full 65W capacity, delivering consistent processing power without the often-experienced performance degradation or thermal throttling. While the core fanless architecture eliminates downtime caused by mechanical fan failures, an optional active cooling kit is available for high-power scenarios to protect dedicated GPUs, guaranteeing stable AI execution while preserving the system's rugged integrity. For seamless deployment across diverse factory environments, the TPC-B620 pairs with 12 different modular display types ranging from 15 to 24in, including high-brightness models for enhanced visibility and slim-bezel models for modern industrial aesthetics.

Intelligent vision and error-proofing edge AI

By combining high-performance processing, dedicated GPU acceleration, and unmatched modular flexibility, the TPC-B620 empowers manufacturers to accelerate smart factory initiatives, minimise human errors, and deploy edge-level intelligence more efficiently. For instance, in complex assembly lines—such as server, automotive component, and high-end electronics manufacturing—the TPC-B620 can serve as an intelligent, real-time safety net to optimize localized workflows for novice operators. Through its high-density LAN ports, the system connects directly to high-resolution cameras to track assembly steps in real time. If an operator misses a screw or places a component in the wrong orientation, the localized Edge AI model instantly detects the anomaly and triggers highly visible red warnings directly on the modular HMI screen, helping prevent costly scrap and boosting overall productivity.

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This content was created in paid collaboration with the Newsletter Editors Andy Pye and Bob Dobson.

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