The TSC1641 is a high-precision AFE that synchronously monitors current and load voltage up to 60 V. It features a 16-bit dual-channel ADC with programmable conversion time and flexible digital bus interface. The device allows for assertion of alerts for voltage, current, power, and temperature, with adjustable thresholds. The TSC1641 operates in a wide temperature range and comes in a compact DFN10 package.

The robust of this dual-channel digital I/O expansion board design meets the requirements of industrial environments and functional safety. The microcontroller pins and peripherals are physically separated from other X-NUCLEO boards, allowing for easy addition of expansion shields without overlapping microcontroller resources. The STSW-FSM01 firmware package is compatible with NUCLEO-F401RE and can be adapted to run on other STM32 Nucleo platforms.

The ISM330DHCX is a high-performance 3D digital accelerometer and gyroscope system-in-package designed for Industry 4.0 applications. ST's MEMS sensor modules use robust and mature manufacturing processes for micromachined accelerometers and gyroscopes. The ISM330DHCX integrates both sensing elements on the same silicon die for superior stability and robustness. It has a wide acceleration and angular rate range, optimized for accuracy, stability, and low noise. The device also features embedded machine learning, programmable FSM, FIFO, sensor hub, event decoding, and interrupts for smart and complex sensor nodes. The ISM330DHCX comes in a compact 14-lead LGA package

This revolutionary silicon carbide Power MOSFET is developed using advanced and innovative 3rd generation ST SiC MOSFET technology. This cutting-edge device boasts a remarkably low RDS(on) over the entire temperature range, combined with low capacitances and extremely high switching operations. These features work together to enhance application performance in frequency, energy efficiency, and system size and weight reduction.

The TSC1641 is a high-precision AFE that synchronously monitors current and load voltage up to 60 V. It features a 16-bit dual-channel ADC with programmable conversion time and flexible digital bus interface. The device allows for assertion of alerts for voltage, current, power, and temperature, with adjustable thresholds. The TSC1641 operates in a wide temperature range and comes in a compact DFN10 package.

The robust of this dual-channel digital I/O expansion board design meets the requirements of industrial environments and functional safety. The microcontroller pins and peripherals are physically separated from other X-NUCLEO boards, allowing for easy addition of expansion shields without overlapping microcontroller resources. The STSW-FSM01 firmware package is compatible with NUCLEO-F401RE and can be adapted to run on other STM32 Nucleo platforms.

The ISM330DHCX is a high-performance 3D digital accelerometer and gyroscope system-in-package designed for Industry 4.0 applications. ST's MEMS sensor modules use robust and mature manufacturing processes for micromachined accelerometers and gyroscopes. The ISM330DHCX integrates both sensing elements on the same silicon die for superior stability and robustness. It has a wide acceleration and angular rate range, optimized for accuracy, stability, and low noise. The device also features embedded machine learning, programmable FSM, FIFO, sensor hub, event decoding, and interrupts for smart and complex sensor nodes. The ISM330DHCX comes in a compact 14-lead LGA package